Question

Difficulty: MediumMotherboard, RAM, CPU, and Power Issues

A technician is troubleshooting a desktop computer that experiences sudden thermal shutdowns during high CPU processing tasks. The technician suspects improper thermal interface material application and heatsink mounting. Place the following remediation steps in the correct chronological order from first to last.

  1. 1Access the UEFI/BIOS hardware monitor to observe baseline CPU idle temperatures and fan speed metrics.
  2. 2Shut down the computer, disconnect the AC power cord, and hold the power button to discharge flea power.
  3. 3Detach the CPU cooling fan assembly and clean off old thermal paste using high-percentage isopropyl alcohol.
  4. 4Apply a fresh pea-sized drop of thermal paste and securely latch the heatsink back onto the CPU socket.
  5. 5Power on the system, launch a CPU stress-testing utility, and verify that operational temperatures remain stable.

Answer

The correct troubleshooting sequence begins with gathering baseline temperature metrics in UEFI/BIOS, discharging flea power after removing power cables, detaching and cleaning the CPU/heatsink surfaces, applying new thermal paste and securing the cooler, and finally stress testing the system to verify thermal stability.
CompTIA hardware troubleshooting methodology requires establishing baseline symptoms first (UEFI hardware monitoring), ensuring safety by cutting power and draining flea power second, performing physical surface preparation and reinstallation third, and finally verifying repair integrity under load.

Step-by-Step Solution

1
Check baseline metrics in UEFI/BIOS
Confirms abnormal idle/load temperatures prior to disassembly.
Establishes a diagnostic baseline according to CompTIA troubleshooting methodology.
2
Disconnect power and drain flea power
Prevents electrical shock and damage to sensitive internal motherboard circuitry.
Safety procedures mandate complete power removal before physical component handling.
3
Unmount cooling unit and clean contact surfaces
Removes old, dried, or improperly applied thermal paste.
Clean metallic surfaces are necessary for optimal thermal transfer.
4
Reapply thermal paste and reinstall heatsink
Restores efficient heat dissipation path from CPU die to heatsink fins.
Correct compound volume and even mounting pressure eliminate thermal gaps.
5
Reboot system and perform load testing
Verifies that CPU temperatures stay within safe operating limits under full load.
Confirming full functionality under stress ensures permanent resolution.

Key Concept

CPU Thermal Management and Safe Component Replacement Procedures
Estimated Time:1m 30s
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