Examkin

Question

Difficulty: MediumMotherboard, RAM, CPU, and Power Issues

A database server operating under sustained workload unexpectedly powers completely off after approximately 15 minutes15\text{ minutes} of use, with no operating system crash logs or blue screen errors recorded. Upon immediately navigating to the system BIOS hardware monitor after rebooting, the technician observes a CPU temperature of 96∘C96^\circ\text{C}. After allowing the system to rest powered off for 20 minutes20\text{ minutes}, the CPU temperature drops to 36∘C36^\circ\text{C} and the server boots normally. Inspection reveals all chassis and CPU cooling fans are spinning at nominal speed and the heatsink fins are free of dust. Which of the following is the most likely root cause of this issue?

  1. Thermal paste between the processor and heatsink has dried out or degraded.Answer
  2. B
    The power supply +12 V+12\text{ V} rail is delivering insufficient wattage under sustained CPU load.
  3. C
    A distended capacitor on the motherboard CPU VRM circuit is causing power instability.
  4. D
    Standard SO-DIMM memory modules were installed into the motherboard expansion slots.

Answer

The most likely root cause is degraded or dried-out thermal paste between the CPU integrated heat spreader and the heatsink.
When thermal paste degrades or dries out over time, it loses thermal conductivity, creating microscopic air pockets that insulate the CPU. Under sustained processing loads, heat accumulates rapidly within the CPU core, exceeding thermal limits (96∘C96^\circ\text{C}) and triggering a protective thermal shutdown to prevent permanent silicon damage. Because the cooling fans are functioning properly and clear of debris, replacing the thermal interface material is the direct resolution.

Step-by-Step Solution

1
Analyze reported system behavior and temperature logs
System powers off after sustained load, BIOS reports extremely high CPU temperature (96∘C96^\circ\text{C}), but cools down back to idle levels (36∘C36^\circ\text{C}) after resting.
This thermal profile indicates heat is building up at the CPU faster than it can be transferred away, triggering thermal safety shutdown mechanisms.
2
Evaluate active cooling hardware components
Cooling fans spin at proper speed and heatsink fins are free of airflow obstructions.
Active airflow is working as intended, ruling out fan failure or dust clogging as the cause of heat retention.
3
Identify passive thermal interface material degradation
Determined that thermal interface material (thermal paste) between CPU and heatsink has dried or separated.
Without effective thermal paste, microscopic air gaps prevent efficient conductive heat transfer from the processor to the heatsink.

Key Concept

CPU Thermal Throttling and Thermal Interface Material (TIM) Failure
Rate this question

Topics

Motherboard, RAM, CPU, and Power Issues

More questions from this topic