A network administrator is troubleshooting an intermittent 10GBASE-LR single-mode optical fiber link between two campus buildings. Switch port diagnostics indicate high optical signal attenuation and excessive return loss (back reflection) following a recent patch panel maintenance window. Optical transceivers on both endpoints report normal transmit power levels. Which of the following actions should the network administrator perform to accurately pinpoint the fault location and resolve the physical layer degradation? (Select TWO.)
- Inspect all fiber end-faces with a optical fiber inspection scope and replace any mixed APC (green) and UPC (blue) connector patch cables with matching connector polish types.Answer
- BConnect a copper Time-Domain Reflectometer (TDR) and wiremap tester to the patch panel ports to calculate signal reflection distance and trace pair continuity.
- Use an Optical Time-Domain Reflectometer (OTDR) to analyze reflection spikes and measure attenuation across splices, bends, and connector transitions along the fiber run.Answer
- DReconfigure both switch interface ports from full-duplex to half-duplex mode to reduce late collision frames resulting from high return loss.
Answer
The administrator must inspect ferrule end-faces using an optical inspection scope to ensure APC and UPC connector polishes are not mixed, and utilize an Optical Time-Domain Reflectometer (OTDR) to pinpoint physical attenuation and reflectometry anomalies along the single-mode fiber run.
High optical return loss and signal attenuation on a single-mode fiber link are key indicators of connector polish mismatches (e.g., mating green APC connectors with blue UPC connectors) or physical cable damage. Using an optical fiber inspection scope allows technicians to identify physical ferrule contamination or polish mismatch, while an Optical Time-Domain Reflectometer (OTDR) precise measures light loss and distance to reflective events across the fiber span.
Step-by-Step Solution
Key Concept
Fiber Optic Physical Layer Troubleshooting & Diagnostic Instrument Selection