An IT technician is reviewing processor socket standards and thermal management technologies for a hardware deployment. Match each CPU socket format or cooling component on the left to its corresponding design characteristic or operational attribute on the right.
- Vapor Chamber CoolingUtilizes a flattened, planar vacuum cavity where internal fluid evaporates and condenses to spread heat across a wide surface area.
- Land Grid Array (LGA)Pins are located inside the motherboard socket socket rather than on the CPU package, reducing risk of bent pins on the processor.
- Direct-Contact Heat PipesExposes flattened copper coolant conduits directly on the base surface to make physical contact with the CPU integrated heat spreader.
- Ball Grid Array (BGA)The processor package is permanently soldered directly onto the motherboard PCB, preventing CPU upgrades or replacement.
Cevap
Vapor Chamber Cooling pairs with the planar vacuum cavity fluid phase-change description; Land Grid Array (LGA) pairs with socket-side pins matching CPU contact pads; Direct-Contact Heat Pipes pair with flattened copper conduits directly contacting the integrated heat spreader; Ball Grid Array (BGA) pairs with permanent surface-mount soldering to the motherboard.
Each technology is paired precisely according to CompTIA hardware specifications: Land Grid Array (LGA) houses pins on the socket; Ball Grid Array (BGA) is surface-soldered directly to the board; Vapor Chamber cooling employs a wide planar phase-change vessel; and Direct-Contact Heat Pipes place bare, flattened heat pipes in direct contact with the CPU integrated heat spreader.
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Anahtar Kavram
CPU packaging architectures (LGA vs BGA) determine socket physical pin placement and field replaceability, while thermal design components (Vapor Chambers vs Direct-Contact Heat Pipes) govern how heat is conducted and spread away from the processor heat spreader.
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