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Zorluk: OrtaCPU Architecture Cooling and Sockets

An IT technician is selecting replacement hardware specifications for an enterprise server platform. The organization mandates a CPU socket design where the socket pins are located directly on the motherboard motherboard surface rather than on the processor package itself, minimizing the risk of damaging processor pins during field replacements. Which CPU socket architecture meets this specific requirement?

  1. A
    Pin Grid Array (PGA)
  2. Land Grid Array (LGA)Cevap
  3. C
    Ball Grid Array (BGA)
  4. D
    Zero Insertion Force (ZIF) PGA

Cevap

Land Grid Array (LGA) places the socket pins on the motherboard, while the CPU package has landing pads.
Land Grid Array (LGA) architecture places the spring-loaded contact pins directly inside the motherboard socket. The processor package itself features flat conductive contact pads (lands), eliminating the possibility of bending processor pins during handling or socket installation.

Adım Adım Çözüm

1
Identify CPU packaging and socket pin placement standards.
LGA places pins on the motherboard socket; PGA places pins on the CPU package; BGA is surface-mounted via solder balls.
The requirement specifically asks for pins integrated onto the motherboard to prevent bending pins on the removable CPU package.
2
Match the requirement to the correct standard.
Land Grid Array (LGA) uses flat gold pads (lands) on the processor and pins on the socket.
This structure fulfills the organizational policy by leaving the processor package pin-free.

Anahtar Kavram

CPU Socket Architecture (LGA vs PGA vs BGA)
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Konular

CPU Architecture Cooling and Sockets

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