A field technician is troubleshooting an enterprise workstation that experiences sudden thermal shutdowns during intensive rendering tasks. The technician questioned the user, reviewed operating system event logs, and established a theory that an improperly seated CPU heat sink following a recent hardware upgrade is causing the overheating. The technician tested this theory by monitoring live thermal sensor telemetry during a stress test, which confirmed that CPU temperatures spike immediately to the maximum thermal threshold before shutting down. According to the standard CompTIA troubleshooting methodology, which of the following actions should the technician take NEXT?
- Develop a plan of action to remove the CPU cooler, reapply thermal paste, and properly seat the heat sink assembly.Cevap
- BPerform extended stress tests and benchmark runs to verify that system temperatures remain within baseline limits.
- CLog the diagnosed root cause and close out the ticket in the organization's IT service management database.
- DReplace the motherboard and main power supply unit to rule out power delivery failures across the CPU VRM.
Cevap
Develop a plan of action to remove the CPU cooler, reapply thermal paste, and properly seat the heat sink assembly.
The scenario describes a technician who has completed Step 1 (Identify the problem), Step 2 (Establish a theory of probable cause), and Step 3 (Test the theory to determine cause). The correct action represents Step 4 of the CompTIA troubleshooting methodology: establish a plan of action to resolve the problem and implement the solution.
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CompTIA 6-Step Troubleshooting Methodology Sequence
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