A field technician is assembling a high-performance workstation for 3D rendering. The build features a multi-core processor utilizing a Land Grid Array (LGA) socket architecture and a heavy-duty active air cooling assembly. Which of the following procedures must the technician perform during processor and heatsink installation to ensure proper physical engagement and effective thermal transfer? (Select TWO.)
- Align the orientation triangle on the corner of the CPU packaging with the corresponding triangle indicator printed on the LGA motherboard socket frame.Cevap
- Apply thermal interface material evenly across the top of the integrated heat spreader (IHS) before securing the active heatsink base.Cevap
- CInspect the array of delicate contact pins protruding directly from the bottom surface of the CPU substrate prior to mounting.
- DCalculate the power supply wattage requirement by using only the CPU Thermal Design Power (TDP) value as the maximum system power consumption.
Cevap
The technician must align the orientation triangle on the CPU packaging with the LGA socket indicator and apply thermal interface material between the CPU integrated heat spreader (IHS) and heatsink cold plate.
Correct installation of an LGA processor requires keying the CPU orientation marker with the motherboard socket indicator to prevent pin damage upon locking the lever. Additionally, thermal interface material must be placed on the CPU integrated heat spreader (IHS) to fill air gaps and ensure efficient heat transfer to the heatsink base.
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Anahtar Kavram
LGA Socket Mechanical Alignment and Thermal Compound Application
Tahmini Süre:1m 30s