A field technician is assembling a workstation computer and installing a CPU into a Land Grid Array (LGA) socket, followed by mounting an active air cooler. Which of the following statements correctly describe the physical characteristics and proper installation considerations for this CPU socket type and cooling setup? (Select TWO.)
- The delicate spring-loaded contact pins are located inside the motherboard socket rather than on the CPU package.Cevap
- Thermal interface material must be applied between the processor integrated heat spreader (IHS) and the heatsink base to bridge microscopic air gaps.Cevap
- CThe pins are protruding from the underside of the processor package, requiring alignment with holes in the motherboard socket.
- DThermal shutdowns occurring immediately after power-on should be resolved by reinstalling display adapter drivers before checking cooler seating.
Cevap
Land Grid Array (LGA) sockets feature pins positioned on the motherboard socket, and thermal compound must be applied between the CPU integrated heat spreader (IHS) and the heatsink base to fill microscopic air voids.
In Land Grid Array (LGA) sockets, the delicate contact pins are located on the motherboard socket itself rather than on the CPU. Additionally, thermal interface material (TIM) is essential to fill microscopic gaps between the processor's integrated heat spreader (IHS) and the heatsink base to facilitate effective conductive heat transfer.
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LGA socket architecture and thermal interface material (TIM) function