Examkin

Soru

Zorluk: OrtaCPU Architecture Cooling and Sockets

A desktop support technician is preparing to replace a motherboard and processor during a workstation upgrade. The technician notes that the target motherboard utilizes a Land Grid Array (LGA) CPU socket architecture. Which of the following describes a defining physical characteristic of an LGA processor socket?

  1. The delicate contact pins are located inside the motherboard socket rather than on the underside of the CPU package.Cevap
  2. B
    The processor package features protruding pins that insert into matching socket holes and secure via a Zero Insertion Force (ZIF) lever.
  3. C
    The processor package is permanently soldered directly onto the surface of the motherboard and cannot be socketed or replaced.
  4. D
    The processor uses passive heat pipes integrated into the pin grid to transfer thermal energy directly through the motherboard layers.

Cevap

The delicate contact pins are located inside the motherboard socket rather than on the underside of the CPU package.
In a Land Grid Array (LGA) socket architecture, the delicate array of contact pins is mounted on the motherboard socket itself. The underside of the CPU package contains flat conductive pads (lands) that make contact with these pins when clamped down.

Adım Adım Çözüm

1
Identify the CPU socket packaging type referenced in the scenario.
The target system uses a Land Grid Array (LGA) socket.
Determining the socket type establishes where the physical pin contacts reside.
2
Differentiate between LGA, PGA, and BGA physical designs.
LGA places spring-loaded pins inside the motherboard socket mating with flat contact pads (lands) on the bottom of the processor chip.
This physical design protects processor pins during handling but makes motherboard socket pins vulnerable to bending.

Anahtar Kavram

CPU Socket Architectures (LGA vs PGA vs BGA)
Tahmini Süre:1m 0s
Bu soruyu puanla

Konular

CPU Architecture Cooling and Sockets

Bu konudan daha fazla soru