A technician is evaluating memory module specifications and system architectures for upcoming desktop, laptop, and server deployments. Match each RAM technology or form factor on the left with its correct operational characteristic or physical specification on the right.
- DDR5 On-Die ECCPerforms internal bit-flip error mitigation directly inside the DRAM chip to manage cell density issues without protecting data on the system memory bus.
- 260-Pin SODIMMCompact physical module standard engineered specifically for DDR4 memory installations in laptops and small-form-factor PCs.
- Dual-Channel ArchitectureDoubles theoretical throughput by accessing two independent 64-bit data paths concurrently across designated paired motherboard slots.
- Side-Band (Standard) ECCDetects and corrects single-bit errors in transit across a dedicated 8-bit bus extension to maintain data integrity on mission-critical servers.
Cevap
DDR5 On-Die ECC matches internal chip-level bit-flip mitigation; 260-Pin SODIMM matches the compact DDR4 laptop module standard; Dual-Channel Architecture matches doubled throughput across paired 64-bit slots; Side-Band ECC matches server data bus error protection using a dedicated 8-bit bus extension.
Each memory technology is paired with its exact technical role: 260-pin SODIMM is the physical form factor for DDR4 laptops; DDR5 On-Die ECC manages reliability internally on the memory chip; Side-Band ECC uses extra bus lines to protect server memory transfers; Dual-Channel Architecture provides doubled bandwidth via concurrent 64-bit memory paths.
Adım Adım Çözüm
Anahtar Kavram
RAM Form Factors, ECC Implementations, and Multi-Channel Architecture