A technician is building a high-performance workstation and installing a new processor along with an All-In-One (AIO) liquid cooling system. Which of the following statements regarding CPU socket architecture and cooling thermal management are correct? (Select TWO.)
- Land Grid Array (LGA) socket designs position the delicate contact pins inside the motherboard socket rather than on the processor package.Cevap
- The protective plastic film covering the AIO cooler's copper cold plate must be peeled off before mounting the heat sink block onto the processor.Cevap
- CPin Grid Array (PGA) sockets utilize flat contact lands on the motherboard surface that align with spring-loaded pins inside the socket.
- DPassive cooling solutions rely on active electric fans attached directly to the metal heat sink to dissipate thermal energy from high-TDP CPUs.
Cevap
The correct statements are that Land Grid Array (LGA) sockets place the contact pins on the motherboard rather than on the CPU package, and that the plastic protective film must be removed from the AIO cooling block's copper plate before mounting.
Land Grid Array (LGA) sockets locate contact pins inside the motherboard socket mating with flat pads on the CPU package. Additionally, removing the protective factory plastic layer from an AIO liquid cooler cold plate is essential for direct thermal conduction between the CPU and the cooler.
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CPU Socket Architecture (LGA vs. PGA) and Thermal Management Procedures