A desktop technician is servicing a high-performance workstation experiencing sudden thermal shutdowns under computational load. Inspection reveals that the CPU cooling assembly was incorrectly installed during a previous maintenance procedure, resulting in improper heat transfer and uneven socket pressure. Which of the following procedures should the technician perform to ensure proper CPU thermal management and socket integrity? (Select TWO.)
- Clean old thermal material from the processor heat spreader using high-purity isopropyl alcohol and apply a fresh, measured amount of thermal compound before mounting.Cevap
- Tighten heatsink retaining screws gradually in a cross-pattern (alternating diagonal corners) to distribute tension evenly across the CPU socket.Cevap
- CApply thermal compound directly onto the Land Grid Array (LGA) socket contact pins prior to seating the processor.
- DForce a Pin Grid Array (PGA) processor package into an LGA motherboard socket if alignment keying notches fail to seat naturally.
Cevap
The technician should clean off old thermal paste with isopropyl alcohol before applying new compound, and tighten heatsink screws in a cross-pattern to distribute mounting pressure evenly across the socket.
Proper thermal management requires thoroughly removing old, degraded thermal paste with isopropyl alcohol before applying new compound. Furthermore, securing the heatsink using an alternating diagonal pattern ensures balanced mounting tension across the CPU socket, establishing consistent contact with the heat spreader without warping the socket or pins.
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CPU Thermal Interface Maintenance and Socket Mounting Procedures