Veridium Industries recently installed a new automated quality-control system for the raw components used in its smartphone assembly plant. This new system detects and discards defective components with 99.9 percent accuracy, successfully eliminating almost all pre-existing component flaws before assembly. However, over the following year, the percentage of fully assembled smartphones failing the standard post-assembly functionality tests due to hardware defects actually increased by 20 percent, even though the final assembly procedures, the workforce, and the post-assembly testing standards remained entirely unchanged.
Which one of the following, if true, most helps to resolve the apparent discrepancy described above?
- AThe automated quality-control system utilizes advanced laser-scanning technology that identifies microscopic structural anomalies that were completely invisible to the human inspectors who previously checked the components.
- BConsumers who purchase newly released smartphones are generally more critical of minor performance issues and are more likely to report hardware defects than consumers who purchase older models.
- The automated quality-control system relies on intense magnetic fields that inadvertently magnetize certain metallic components, causing them to short-circuit only when connected to the smartphone's power supply during final testing.Cevap
- DBecause the automated inspection process requires far less time than manual inspection, Veridium Industries was able to increase its total daily production of fully assembled smartphones by nearly 40 percent.
- ETo guarantee the highest possible quality, the new automated system is programmed to aggressively discard any component that shows even the slightest deviation from optimal manufacturing specifications.
Cevap
The option stating that the automated system relies on intense magnetic fields that inadvertently magnetize components, causing them to short-circuit during final testing.
The correct answer provides a mechanism that bridges both sides of the discrepancy. It accepts Premise A (the system successfully removes pre-existing flaws) but introduces a critical new variable: the system itself creates a latent defect (magnetization). Because this latent defect only causes a short-circuit when the phone is finally powered on during the post-assembly test, it perfectly explains why the final failure rate increased (Premise B) despite the components being 'flawless' when they originally entered the assembly line.
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