When assembling an electronics circuit board, a technician must follow the standard workshop procedure to create a reliable solder connection. In what chronological sequence should the technician perform these steps to complete a sound through-hole solder joint?
- 1Clean and lightly tin the heated soldering iron tip on a damp sponge or brass wire cleaner.
- 2Apply the flat face of the iron tip simultaneously to both the component lead and the circuit board pad.
- 3Feed rosin-core solder directly onto the heated joint on the side opposite the iron tip.
- 4Remove the solder wire first, followed immediately by lifting the soldering iron tip from the joint.
- 5Allow the solder joint to cool undisturbed until the alloy solidifies into a bright, concave fillet.
Cevap
The correct procedural sequence is: (1) Clean and lightly tin the heated iron tip, (2) Apply the iron tip simultaneously to the lead and pad, (3) Feed rosin-core solder directly to the heated joint, (4) Remove the solder strand followed immediately by the iron tip, and (5) Allow the joint to cool completely undisturbed.
A sound solder connection requires preparing a clean thermal bridge on the iron tip, heating the joint surfaces simultaneously, feeding solder directly to the heated workpiece so flux can clean the metal, withdrawing the solder followed by the heat source, and allowing the connection to solidify without any mechanical movement.
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Standard procedural sequence for creating a reliable electrical through-hole solder joint
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