Examkin

Question

Difficulty: MediumCPU Architecture Cooling and Sockets

A technician is disassembling a compact, ultra-thin laptop for repair and notices that the central processing unit cannot be removed from the motherboard using a socket lever or standard release mechanism. The chip is permanently soldered directly onto the circuit board using a grid of small solder balls underneath the processor package. Which of the following CPU packaging formats is implemented on this motherboard?

  1. BGA (Ball Grid Array)Answer
  2. B
    LGA (Land Grid Array)
  3. C
    PGA (Pin Grid Array)
  4. D
    ZIF (Zero Insertion Force)

Answer

Ball Grid Array (BGA) is the packaging format where the CPU is permanently soldered onto the motherboard via a grid of solder spheres.
Ball Grid Array (BGA) packages feature a grid of solder balls on the underside of the chip processor package. During manufacturing, the chip is placed on the motherboard and heated to solder it directly to the PCB. This eliminates the height and cost of a socket assembly, which is standard practice in ultra-thin laptops and mobile devices.

Step-by-Step Solution

1
Analyze the physical CPU installation characteristics described in the scenario.
The CPU is permanently affixed to the board using solder balls underneath the package with no socket mechanism.
Identifying physical attachment methods distinguishes removable socket types from permanent surface-mount packages.
2
Compare CPU socket and packaging types.
BGA (Ball Grid Array) mounts directly via solder balls. LGA and PGA utilize motherboard sockets with locking mechanisms to allow CPU removal.
BGA is used in thin laptops and mobile devices where vertical clearance is minimal and upgradeability is not required.

Key Concept

CPU Socket and Package Types (BGA vs. LGA vs. PGA)
Rate this question

Topics

CPU Architecture Cooling and Sockets

More questions from this topic