A technician is installing a replacement processor and thermal cooling solution onto a desktop motherboard that features a Land Grid Array (LGA) socket. Which TWO of the following statements accurately describe the physical characteristics and proper installation procedures for this hardware configuration?
- The motherboard socket contains spring-loaded contact pins, while the processor underside features flat gold contact pads.Answer
- BThe processor package houses delicate metal pins that must align with pinholes on the motherboard socket receptacle.
- Thermal compound must be applied between the integrated heat spreader (IHS) of the CPU and the cold plate of the heat sink.Answer
- DThermal compound must be spread directly over the exposed motherboard socket pins before seating the processor package.
Answer
The motherboard socket contains spring-loaded contact pins while the CPU features flat gold pads, and thermal compound must be applied between the CPU integrated heat spreader and the cold plate of the heat sink.
Land Grid Array (LGA) sockets place delicate spring-loaded pins inside the motherboard socket, matching flat gold contacts on the bottom of the processor chip. Additionally, thermal paste must be applied between the integrated heat spreader (IHS) on top of the CPU and the metal heat sink cold plate to bridge air gaps for effective thermal dissipation.
Step-by-Step Solution
Key Concept
LGA socket physical characteristics and CPU thermal interface application procedures.