An IT technician is auditing system hardware specifications to update documentation for workstation builds. Match each CPU packaging design or thermal management solution on the left to its corresponding technical characteristic on the right.
- Land Grid Array (LGA)Pins are located on the motherboard socket, matching contact pads on the underside of the processor.
- Pin Grid Array (PGA)Pins are located on the underside of the CPU package and insert into holes in the motherboard socket.
- Ball Grid Array (BGA)Processor is permanently soldered directly onto the motherboard surface using small solder spheres.
- Passive HeatsinkDissipates heat using metal fins via thermal conduction and air convection without a dedicated powered fan.
Answer
Land Grid Array (LGA) matches with pins located on the motherboard socket; Pin Grid Array (PGA) matches with pins located on the underside of the CPU package; Ball Grid Array (BGA) matches with processor soldered directly to the motherboard; Passive Heatsink matches with heat dissipation via metal fins without a fan.
Each CPU packaging format and cooling component matches its definitive design: LGA places pins on the socket, PGA places pins on the CPU package, BGA uses permanent surface solder joints, and passive heatsinks operate without powered moving fans.
Step-by-Step Solution
Key Concept
CPU packaging architectures (LGA, PGA, BGA) and thermal cooling methods