Match each CPU architectural feature or cooling solution on the left with its corresponding technical characteristic on the right.
- Land Grid Array (LGA)Pins are located on the motherboard socket rather than on the processor package.
- Passive Heat SinkDissipates heat without moving parts by relying on convection and thermal radiation.
- Simultaneous Multithreading (Hyper-Threading)Allows a single physical CPU core to execute two independent computational threads concurrently.
- All-in-One (AIO) Liquid CoolerUses a sealed loop with a pump, liquid coolant, and radiator to transfer thermal energy away from the CPU.
Answer
Land Grid Array (LGA) matches with 'Pins are located on the motherboard socket rather than on the processor package.' Passive Heat Sink matches with 'Dissipates heat without moving parts by relying on convection and thermal radiation.' Simultaneous Multithreading (Hyper-Threading) matches with 'Allows a single physical CPU core to execute two independent computational threads concurrently.' All-in-One (AIO) Liquid Cooler matches with 'Uses a sealed loop with a pump, liquid coolant, and radiator to transfer thermal energy away from the CPU.'
Land Grid Array (LGA) describes socket pins residing on the motherboard. A passive heat sink cools via conduction/radiation without fans or moving parts. Simultaneous Multithreading enables two logical threads per physical CPU core. An AIO liquid cooler uses a sealed pump and radiator loop to manage processor thermal output.
Step-by-Step Solution
Key Concept
CPU Sockets, Cooling Technologies, and Architectural Features
Estimated Time:1m 30s