A system technician is upgrading hardware across specialized desktop workstations. One high-performance workstation requires replacing a failed All-in-One (AIO) liquid cooling system with a low-maintenance solution, while another requires upgrading a CPU on a motherboard utilizing a Land Grid Array (LGA) socket. Which of the following technical steps and architectural principles should the technician apply during these procedures? (Select TWO.)
- Verify that the replacement processor features flat gold-plated contact pads on its underside, as LGA socket designs place the delicate contact pins inside the motherboard socket housing.Answer
- Mount a high-efficiency active air cooler with copper heat pipes and a high-static-pressure fan to eliminate pump failure points and liquid leakage risks while maintaining thermal transfer.Answer
- CAttribute a system that fails POST with no beep codes or display output to a corrupted display driver, and re-install the GPU software prior to checking physical power delivery.
- DBypass applying thermal interface material (TIM) between the processor's integrated heat spreader and the new heatsink base if the air cooler fan operates at speeds exceeding 3000 RPM.
Answer
The correct selections state that LGA sockets feature pins located on the motherboard which align with contact pads on the processor underside, and that replacing an AIO liquid cooler with an active heat-pipe air cooling assembly eliminates fluid leakage and pump failure risks.
LGA socket designs locate fragile pins on the motherboard socket, matching surface pads on the CPU package. Replacing an AIO liquid cooler with an active air heat-pipe cooler eliminates mechanical pump failure and fluid leaks while providing effective cooling.
Step-by-Step Solution
Key Concept
CPU Socket Architecture (LGA) and Thermal Cooling Mechanisms