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Difficulty: MediumCPU Architecture Cooling and Sockets

A technician is preparing to install a replacement processor into a desktop workstation motherboard. Upon inspecting the CPU socket, the technician observes hundreds of small, delicate pins built directly onto the motherboard socket grid itself, while the underside of the CPU features flat gold contact pads without any pins. Which CPU socket packaging architecture is featured on this motherboard?

  1. Land Grid Array (LGA)Answer
  2. B
    Pin Grid Array (PGA)
  3. C
    Ball Grid Array (BGA)
  4. D
    Zero Insertion Force (ZIF) PGA

Answer

Land Grid Array (LGA)
Land Grid Array (LGA) is the CPU socket architecture where the spring-loaded contact pins are housed within the motherboard socket, aligning with flat gold land pads on the underside of the processor package.

Step-by-Step Solution

1
Analyze the physical physical characteristics described in the scenario.
The pins are located inside the motherboard socket, and the processor has flat contact pads on its underside.
Identifying pin placement distinguishes between Land Grid Array (LGA) and Pin Grid Array (PGA) packaging.
2
Map pin placement to socket architecture types.
LGA places pins on the motherboard socket, PGA places pins on the processor package, and BGA solders the processor directly to the board without a removable socket.
LGA transfers the risk of bent pins from the expensive processor to the motherboard socket.

Key Concept

CPU Socket Architectures (LGA vs. PGA vs. BGA)
Estimated Time:1m 0s
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Topics

CPU Architecture Cooling and Sockets

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