Examkin

Question

Difficulty: MediumCPU Architecture Cooling and Sockets

During a CPU replacement on a desktop motherboard, a technician observes arrayed copper pin contacts built directly into the socket housing, whereas the underside of the replacement processor consists strictly of flat landing pads. Which socket technology is being utilized?

  1. Land Grid Array (LGA)Answer
  2. B
    Pin Grid Array (PGA)
  3. C
    Ball Grid Array (BGA)
  4. D
    Single Edge Contact Cartridge (SECC)

Answer

Land Grid Array (LGA)
Land Grid Array (LGA) architecture places the array of spring-loaded contact pins inside the motherboard socket, requiring the CPU to have matching flat contact pads (lands) on its underside.

Step-by-Step Solution

1
Analyze the physical location of the contact pins mentioned in the scenario.
The pins are located inside the motherboard socket rather than on the CPU package.
Determining pin location distinguishes between motherboard socket types.
2
Match the pin arrangement characteristics to CPU socket standards.
Sockets with internal pins and flat pads on the CPU correspond to Land Grid Array (LGA).
LGA shifts delicate pins from the removable processor to the mainboard socket.

Key Concept

CPU Socket Architecture (LGA vs PGA vs BGA)
Rate this question

Topics

CPU Architecture Cooling and Sockets

More questions from this topic