A technician is categorizing CPU packaging standards and cooling system components during an IT inventory audit. Match each processor socket standard or thermal management technology on the left to its defining architectural or physical characteristic on the right.
- Land Grid Array (LGA)Spring-loaded pins reside inside the motherboard socket contacting flat landing pads on the processor.
- Pin Grid Array (PGA)Arrayed metal pins extend from the underside of the processor package into socket receptacles.
- Ball Grid Array (BGA)Processor is permanently mounted to the motherboard PCB via reflowed solder spheres.
- AIO Liquid Cooling LoopSealed system containing a water block, fluid pump, flexible tubing, and heat radiator.
Answer
Land Grid Array (LGA) corresponds to spring-loaded pins inside the motherboard socket; Pin Grid Array (PGA) corresponds to pins extending from the underside of the processor package; Ball Grid Array (BGA) corresponds to the processor being permanently soldered via solder spheres; AIO Liquid Cooling Loop corresponds to a sealed system with a water block, pump, tubing, and radiator.
Land Grid Array (LGA) features socket-side pins resting against pads on the processor bottom. Pin Grid Array (PGA) features chip-side pins that insert into matching socket holes. Ball Grid Array (BGA) utilizes surface-mount solder balls to permanently attach the chip to the PCB. All-In-One (AIO) liquid cooling uses a pre-filled, sealed fluid loop containing a pump block, tubes, and radiator assembly.
Step-by-Step Solution
Key Concept
CPU Socket Architectures and Thermal Cooling Systems